The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Aug. 11, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Robert F. Steimle, Austin, TX (US);

Dwight L. Daniels, Phoenix, AZ (US);

Veera M. Gunturu, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 21/02 (2006.01); H01L 21/82 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); H01L 21/02013 (2013.01); H01L 21/561 (2013.01); H01L 21/82 (2013.01); H01L 23/564 (2013.01);
Abstract

A method for protecting terminal elements on a wafer during wafer level fabrication processes entails applying a protective coating to the terminal elements prior to further processing operations. These processing operations may include back side grinding of the wafer and/or saw-to-reveal operations to expose the terminal elements from a cap wafer of a wafer structure. The protective coating can protect the terminal elements from potentially damaging contaminants, such as debris from the grinding or saw-to-reveal operations. Furthermore, the protective coating can protect the bond pads from coming into contact with a rapidly oxidizing environment when exposed to water. The protective coating may be a hot-water soluble thermoplastic material the melts from a solid form to a liquid form at a relatively low temperature to enable application of the protective coating in liquid form onto the terminal elements and clean removal of the protective coating from the terminal elements.


Find Patent Forward Citations

Loading…