The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
May. 19, 2022
Nxp Usa, Inc., Austin, TX (US);
Namrata Kanth, Mesa, AZ (US);
Paul Southworth, Groesbeek, NL;
Scott M. Hayes, Chandler, AZ (US);
Dwight Lee Daniels, Phoenix, AZ (US);
Yufu Liu, Taoyuan, TW;
Jeroen Johannes Maria Zaal, Nijmegen, NL;
Cheong Chiang Ng, Cheras, MY;
NXP USA, Inc., Austin, TX (US);
Abstract
An electronic device substrate with a substantially planar surface formed from an electrically non-conductive material is provided with one or more metalized pads on the substantially planner surface. Each of the one or more metalized pads is surrounded by and coplanar with the first electrically nonconductive material along an outer boundary of the metalized pad. The metalized pad is patterned such that portions of the metalized pad form metalized fingers that extend radially from the outer boundary of the metalized pad in an interdigitated arrangement with the first electrically nonconductive material. The metalized pad has a solderable surface.