The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2014

Filed:

Jun. 29, 2012
Applicants:

Dwight L. Daniels, Phoenix, AZ (US);

Stephen R. Hooper, Mesa, AZ (US);

Alan J. Magnus, Gilbert, AZ (US);

Justin E. Poarch, Gilbert, AZ (US);

Inventors:

Dwight L. Daniels, Phoenix, AZ (US);

Stephen R. Hooper, Mesa, AZ (US);

Alan J. Magnus, Gilbert, AZ (US);

Justin E. Poarch, Gilbert, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure and method to improve saw singulation quality and wettability of integrated circuit packages () assembled with lead frames () having half-etched recesses () in leads. A method of forming a semiconductor device package includes providing a lead frame strip () having a plurality of lead frames. Each of the lead frames includes a depression () that is at least partially filled with a material () prior to singulating the strip.


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