The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Nov. 10, 2014
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Akhilesh K. Singh, Austin, TX (US);

Dwight L. Daniels, Phoenix, AZ (US);

Darrel R. Frear, Phoenix, AZ (US);

Stephen R. Hooper, Mesa, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/26 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00309 (2013.01); H01L 23/26 (2013.01); H01L 23/29 (2013.01); H01L 23/3135 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/012 (2013.01);
Abstract

A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor material. The bubble restrictor material functions to inhibit the formation and growth of moisture-related bubbles within the material, including at the interfaces of the material and surfaces within the package housing. The media resistant material is resistant to physical and chemical alterations by media within an external environment to which the device is exposed. The media resistant material and bubble resistant material function to transfer a sensed characteristic of the media to the electronic circuit.


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