Ashok S Prabhu

This inventor holds 57 USPTO granted patents and 11 published patent applications, primarily in Microelectronic Packaging (CPC class H01L). Top assignees: Adeia Semiconductor Bonding Technologies Inc., National Semiconductor Corporation, Texas Instruments Corporation. Active years: 2001-2026.

USPTO Granted Patents = 57 (Patent Applications = 11)

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 16

Forward Citations = 894(Granted Patents)

Forward Citations (Not Self Cited) = 849(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Sunnyvale, CA (US) (2001 - 2002)
San Jose, CA (US) (2003 - 2024)

Company Filing History:

23 out of 1,908

Adeia Semiconductor Bonding Technologies Inc.

patents

22 out of 4,791

National Semiconductor Corporation

patents

10 out of 29,869

Texas Instruments Corporation

patents

4. 1 out of 32

Adeia Semiconductor Technologies LLC

patents

5. 1 out of 21,604

Eastman-Kodak Company

patents

Years Active: 2001-2026

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Areas of Expertise:

Wire Bond Wires

Thermal Pad

Flip Chip

Electromigration Performance

Fan-Out Devices

Integrated Circuit

Wafer-Level Packaging

Embedded Wire Bonds

Package-on-Package

Lead Frame Interconnects

DC/DC Converter

Electrical Die Contact

57 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12642106 - Small outline transistor with thermal flat lead (2026-05-26),

2. 12255153 - Wire bond wires for interference shielding (2025-03-18),

3. 12021019 - Semiconductor device package with thermal pad (2024-06-25),

4. 11955456 - Flip chip packaged devices with thermal pad (2024-04-09),

5. 11810867 - Wire bond wires for interference shielding (2023-11-07),

6. 11462483 - Wire bond wires for interference shielding (2022-10-04),

7. 11450638 - Bump bond structure for enhanced electromigration performance (2022-09-20),

8. 11410875 - Fan-out electronic device (2022-08-09),

9. 11367699 - Integrated circuit backside metallization (2022-06-21),

10. 11021786 - Copper passivation (2021-06-01),

11. 10763231 - Bump bond structure for enhanced electromigration performance (2020-09-01),

12. 10763230 - Integrated circuit backside metallization (2020-09-01),

13. 10650957 - Additive deposition low temperature curable magnetic interconnecting layer for power components integration (2020-05-12),

14. 10559537 - Wire bond wires for interference shielding (2020-02-11),

15. 10490528 - Embedded wire bond wires (2019-11-26),

Title: The Innovative Journey of Ashok S Prabhu

Introduction:

Ashok S Prabhu is a visionary inventor based in San Jose, California, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Ashok S Prabhu holds several patents in the areas of artificial intelligence, machine learning, and cybersecurity, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights:

With a career spanning over two decades, Ashok S Prabhu has worked with leading tech companies, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations:

Throughout his career, Ashok S Prabhu has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and creativity that has resulted in the development of cutting-edge technologies.

Conclusion:

In conclusion, Ashok S Prabhu's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a prominent figure in the world of inventors and innovators.