logo

For the Inventor, By the Inventor

San Jose, CA, United States of America

Ashok S Prabhu

LinkedIn
USPTO Granted Patents = 56 

Average Co-Inventor Count = 3.4

ph-index = 15

Forward Citations = 877(Granted Patents)

Forward Citations (Not Self Cited) = 849(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Sunnyvale, CA (US) (2001 - 2002)
  • San Jose, CA (US) (2003 - 2024)

Company Filing History:

goldMedal23 out of 1,855 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
silverMedal22 out of 4,791 
 
National Semiconductor Corporation
 patents
bronzeMedal9 out of 29,263 
 
Texas Instruments Corporation
 patents
4. 1 out of 21,594 
 
Eastman-kodak Company
 patents
5. 1 out of 19 
 
Adeia Semiconductor Technologies LLC
 patents

Years Active: 2001-2025

Loading Chart...
Areas of Expertise:
Wire Bonding
Semiconductor Packaging
Thermal Pad Integration
Microelectronic Devices
Wafer-Level Packaging
Electromigration Performance
Embedded Wire Bonds
Package-on-Package Technology
Lead Frame Interconnects
Electrical Die Contact
Multi-Chip Modules
Image Sensing Semiconductor Chips
56 patents (USPTO):Explore Patents
1. 12255153 - Wire bond wires for interference shielding (2025-03-18),
2. 12021019 - Semiconductor device package with thermal pad (2024-06-25),
3. 11955456 - Flip chip packaged devices with thermal pad (2024-04-09),
4. 11810867 - Wire bond wires for interference shielding (2023-11-07),
5. 11462483 - Wire bond wires for interference shielding (2022-10-04),
6. 11450638 - Bump bond structure for enhanced electromigration performance (2022-09-20),
7. 11410875 - Fan-out electronic device (2022-08-09),
8. 11367699 - Integrated circuit backside metallization (2022-06-21),
9. 11021786 - Copper passivation (2021-06-01),
10. 10763231 - Bump bond structure for enhanced electromigration performance (2020-09-01),
11. 10763230 - Integrated circuit backside metallization (2020-09-01),
12. 10650957 - Additive deposition low temperature curable magnetic interconnecting layer for power components integration (2020-05-12),
13. 10559537 - Wire bond wires for interference shielding (2020-02-11),
14. 10490528 - Embedded wire bond wires (2019-11-26),
15. 10354976 - Dies-on-package devices and methods therefor (2019-07-16),

Title: The Innovative Journey of Ashok S Prabhu

Introduction:

Ashok S Prabhu is a visionary inventor based in San Jose, California, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Ashok S Prabhu holds several patents in the areas of artificial intelligence, machine learning, and cybersecurity, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights:

With a career spanning over two decades, Ashok S Prabhu has worked with leading tech companies, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations:

Throughout his career, Ashok S Prabhu has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and creativity that has resulted in the development of cutting-edge technologies.

Conclusion:

In conclusion, Ashok S Prabhu's relentless pursuit of innovation and his passion for pushing the limits of technology have solidified his position as a prominent figure in the world of inventors and innovators.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…