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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10650957 B1

PDFFull Text
Date of Patent:
May. 12, 2020

Filed:

Oct. 31, 2018

Additive deposition low temperature curable magnetic interconnecting layer for power components integration

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Yi Yan, Sunnyvale, CA (US);

Luu Thanh Nguyen, San Jose, CA (US);

Ashok Prabhu, San Jose, CA (US);

Anindya Poddar, Sunnyvale, CA (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Ronald O. Neerings

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
H01F 27/26 (2006.01); H01F 27/40 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01F 27/28 (2006.01); H01F 41/24 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01F 27/266 (2013.01); H01F 27/2804 (2013.01); H01F 27/40 (2013.01); H01F 41/24 (2013.01); H01L 23/49575 (2013.01); H01L 23/49589 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01F 2027/2819 (2013.01); H01L 23/3107 (2013.01); H01L 2223/6666 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48195 (2013.01);
Abstract

Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.

Find Patent Forward Citations

Yan, Yi. (2020). Additive deposition low temperature curable magnetic interconnecting layer for power components integration (U.S. Patent No. 10650957). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10650957

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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