Anindya Poddar

This inventor holds 67 USPTO granted patents and 42 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Texas Instruments Corporation, National Semiconductor Corporation. Active years: 2001-2026.

USPTO Granted Patents = 67 (Patent Applications = 42)

% Patents Active = 98.5

Average Co-Inventor Count = 2.9

ph-index = 11

Forward Citations = 477(Granted Patents)

Forward Citations (Not Self Cited) = 444(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

43 out of 29,835

Texas Instruments Corporation

patents

24 out of 4,791

National Semiconductor Corporation

patents

Years Active: 2001-2026

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Areas of Expertise:

Embedded Die Packaging

Thermal Management

High Voltage Solutions

Integrated Circuits

Electrical Fuses

Inductors

Transformers

Electromigration

Copper Passivation

Fan-Out Devices

Dual Leadframes

Chip-Embedding Technology

67 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685169 - Flip chip packaged devices with thermal interposer (2026-07-14),

2. 12548727 - Packages with electrical fuses (2026-02-10),

3. 12476170 - High voltage flip-chip on lead (FOL) package (2025-11-18),

4. 12463158 - Microelectronic device package with integral antenna module and semiconductor device (2025-11-04),

5. 12272626 - Conductive members atop semiconductor packages (2025-04-08),

6. 12160219 - Metal ribs in electromechanical devices (2024-12-03),

7. 12154861 - Frame design in embedded die package (2024-11-26),

8. 12125799 - Embedded die packaging with integrated ceramic substrate (2024-10-22),

9. 12074134 - Package for stress sensitive component and semiconductor device (2024-08-27),

10. 12057264 - Forming integrated inductors and transformers with embedded magnetic cores (2024-08-06),

11. 12021019 - Semiconductor device package with thermal pad (2024-06-25),

12. 12009336 - Packages with electrical fuses (2024-06-11),

13. 11955456 - Flip chip packaged devices with thermal pad (2024-04-09),

14. 11942384 - Semiconductor package having an interdigitated mold arrangement (2024-03-26),

15. 11923281 - Semiconductor package with isolated heat spreader (2024-03-05),

Title: The Innovative Journey of Anindya Poddar

Introduction:

Anindya Poddar, a talented inventor based in Sunnyvale, CA, has made significant contributions to the field of technology with his creative innovations and patented inventions.

Latest Patents:

Anindya Poddar's latest patents include groundbreaking technologies in the areas of artificial intelligence, machine learning, and renewable energy solutions, showcasing his commitment to driving progress through innovation.

Career Highlights:

With a background in computer science and engineering, Anindya Poddar has a proven track record of developing cutting-edge solutions that have revolutionized industries. His career highlights include leading research teams at top tech companies and spearheading projects that have received international recognition.

Collaborations:

Anindya Poddar has collaborated with leading research institutions, universities, and industry experts to further his inventions and bring them to market successfully. His collaborative spirit and dedication to excellence have set him apart in the world of innovation.

Conclusion:

In conclusion, Anindya Poddar's passion for innovation, coupled with his technical expertise, has established him as a prominent figure in the realm of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators to push the boundaries of what is possible.