The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Jan. 23, 2020
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Anindya Poddar, Sunnyvale, CA (US);
Thomas Dyer Bonifield, Dallas, TX (US);
Woochan Kim, Sunnyvale, CA (US);
Vivek Kishorechand Arora, San Jose, CA (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/4821 (2013.01); H01L 23/4951 (2013.01); H01L 23/53228 (2013.01);
Abstract
Described herein is a technology or a method for fabricating a flip-chip on lead (FOL) semiconductor package. A lead frame includes an edge on surface that has a geometric shape that provides a radial and uniform distribution of electric fields. By placing the formed geometric shape along an active die of a semiconductor chip, the electric fields that are present in between the lead frame and the semiconductor chip are uniformly concentrated.