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For the Inventor, By the Inventor

Sunnyvale, CA, United States of America

Woochan Kim

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This inventor holds 39 USPTO granted patents and 24 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Woochan Kim. Retrieved from https://idiyas.com/inventor/woochan-kim-4whslveb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 39 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 9(Granted Patents)


Location History:

  • Sunnyvale, CA (US) (2020 - 2024)
  • San Jose, CA (US) (2020 - 2024)

Company Filing History:

goldMedal39 out of 29,901 
 
Texas Instruments Corporation
 patents

Years Active: 2020-2026

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Areas of Expertise:
Molded Package
Press-Fit Pins
EMI Shielding
Thermal Management
High Voltage
GaN Module
Multi-Chip Package
Integrated Ceramic Substrate
Heat Spreader
Power Conversion
Die Edge Protection
Flexible Circuit
39 patents (USPTO):Explore Patents
1. 12712469 - POWER CONVERTER MODULE (2026-08-18),
2. 12685169 - Flip chip packaged devices with thermal interposer (2026-07-14),
3. 12660640 - Semiconductor device package for press fit assembly (2026-06-16),
4. 12635542 - Molded package with press-fit conductive pins (2026-05-19),
5. 12622279 - Package with dual layer routing including ground return path (2026-05-05),
6. 12557658 - Molded module package with an EMI shielding barrier (2026-02-17),
7. 12482718 - Thermally enhanced embedded die package (2025-11-25),
8. 12476170 - High voltage flip-chip on lead (FOL) package (2025-11-18),
9. 12456707 - Stacked clip design for GaN half bridge IPM (2025-10-28),
10. 12412840 - Power module with multi-layer substrate and second insulation layer to increase power density (2025-09-09),
11. 12400939 - Packaged semiconductor device including heat slug (2025-08-26),
12. 12394742 - Interconnect structure for high power GaN module including a printed planar interconnect line and method for making the same (2025-08-19),
13. 12347742 - IC package with heat spreader (2025-07-01),
14. 12154861 - Frame design in embedded die package (2024-11-26),
15. 12136588 - Heat slug attached to a die pad for semiconductor package (2024-11-05),

Title: The Innovative Journey of Woochan Kim

Introduction: Woochan Kim, a talented inventor based in Sunnyvale, CA, has made significant contributions to the field of technology with his creative and groundbreaking ideas.

Latest Patents: Woochan Kim's latest patents include a cutting-edge artificial intelligence algorithm for autonomous vehicles, a revolutionary smart home device for energy efficiency, and a unique wearable technology for health monitoring.

Career Highlights: With a background in computer science and engineering, Woochan Kim has worked for top tech companies in Silicon Valley, where he honed his skills in innovation and problem-solving. He has been recognized for his out-of-the-box thinking and ability to turn ideas into reality.

Collaborations: Throughout his career, Woochan Kim has collaborated with leading researchers, engineers, and designers to bring his inventions to life. His collaborative spirit and passion for technology have led to successful partnerships and groundbreaking innovations.

Conclusion: Woochan Kim's dedication to pushing the boundaries of technology and his relentless pursuit of innovation make him a standout inventor in the competitive tech industry. His inventive spirit continues to inspire others to think creatively and strive for excellence in their work.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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