The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2026

Filed:

Dec. 17, 2018
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Woochan Kim, Sunnyvale, CA (US);

Benjamin Allen Samples, San Jose, CA (US);

Vivek Kishorechand Arora, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H10D 62/85 (2025.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4825 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3135 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16258 (2013.01); H01L 2224/1626 (2013.01); H10D 62/8503 (2025.01);
Abstract

A package includes a first leadframe including a plurality of leads and a conductor, a first semiconductor die mounted on a first surface of the first leadframe and attached to a first subset of the plurality of leads and the conductor, and a second semiconductor die mounted on the first surface of the first leadframe and attached a second subset of the plurality of leads and the conductor. The conductor provides a direct electrical connection for an electrical signal between the first semiconductor die and the second semiconductor die. The package further includes a second leadframe. The first leadframe is mounted on the second leadframe via a second surface of the first leadframe, the second surface opposite the first surface. The second leadframe provides a ground return path between the between the first semiconductor die and the second semiconductor die for the electrical signal.


Find Patent Forward Citations

Kim, Woochan. (2026). Package with dual layer routing including ground return path (U.S. Patent No. 12622279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12622279

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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