The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Oct. 29, 2021
Texas Instruments Incorporated, Dallas, TX (US);
Anindya Poddar, Sunnyvale, CA (US);
Ashok Surendra Prabhu, San Jose, CA (US);
Edgar Dorotyao Balidoy, Virac, PH;
Hau Nguyen, San Jose, CA (US);
Makoto Yoshino, Beppu, JP;
Ming Li, Chengdu, CN;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.