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For the Inventor, By the Inventor

San Jose, CA, United States of America

Hau Thanh Nguyen

This inventor holds 29 USPTO granted patents and 16 published patent applications, primarily in Semiconductor Packaging. Top assignees: Texas Instruments Corporation, National Semiconductor Corporation. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hau Thanh Nguyen. Retrieved from https://idiyas.com/inventor/hau-thanh-nguyen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 96.6

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 114(Granted Patents)


Company Filing History:

goldMedal19 out of 29,901 
 
Texas Instruments Corporation
 patents
silverMedal10 out of 4,791 
 
National Semiconductor Corporation
 patents

Years Active: 2005-2026

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Areas of Expertise:
Small Outline Transistor
Thermal Flat Lead
Embedded Die Package
Stress Sensitive Component
Flip Chip Packaging
Bump Bond Structure
Electromigration Performance
Wafer Level Packages
Integrated Circuit
Thermal Management
Optoelectronic Package
Electrical Connector
29 patents (USPTO):Explore Patents
1. 12642106 - Small outline transistor with thermal flat lead (2026-05-26),
2. 12160219 - Metal ribs in electromechanical devices (2024-12-03),
3. 12154861 - Frame design in embedded die package (2024-11-26),
4. 12074134 - Package for stress sensitive component and semiconductor device (2024-08-27),
5. 12021019 - Semiconductor device package with thermal pad (2024-06-25),
6. 11955456 - Flip chip packaged devices with thermal pad (2024-04-09),
7. 11736085 - Metal ribs in electromechanical devices (2023-08-22),
8. 11450638 - Bump bond structure for enhanced electromigration performance (2022-09-20),
9. 11410875 - Fan-out electronic device (2022-08-09),
10. 11367699 - Integrated circuit backside metallization (2022-06-21),
11. 11183441 - Stress buffer layer in embedded package (2021-11-23),
12. 11158595 - Embedded die package multichip module (2021-10-26),
13. 10763231 - Bump bond structure for enhanced electromigration performance (2020-09-01),
14. 10763230 - Integrated circuit backside metallization (2020-09-01),
15. 10580715 - Stress buffer layer in embedded package (2020-03-03),

Title: The Innovative Mind of Hau Thanh Nguyen

Introduction: Hau Thanh Nguyen, a talented inventor based in San Jose, CA, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hau Thanh Nguyen holds several patents in the areas of artificial intelligence, machine learning, and renewable energy technologies, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Hau Thanh Nguyen has worked with leading tech companies in Silicon Valley, where he has played a key role in developing cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout his career, Hau Thanh Nguyen has collaborated with top researchers, engineers, and scientists from renowned universities and research institutions, fostering a culture of innovation and excellence in all his projects.

Conclusion: Hau Thanh Nguyen's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs, solidifying his legacy as a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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