The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Aug. 15, 2022
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H10W 70/04 (2026.01); H10W 70/40 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 74/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/461 (2026.01); H10W 70/048 (2026.01); H10W 70/417 (2026.01); H10W 70/438 (2026.01); H10W 70/481 (2026.01); H10W 74/014 (2026.01); H10W 74/016 (2026.01); H10W 74/121 (2026.01); H10W 72/536 (2026.01); H10W 72/884 (2026.01); H10W 74/00 (2026.01); H10W 90/736 (2026.01); H10W 90/756 (2026.01);
Abstract
An electronic device includes a die attach pad, a semiconductor die, a lead, a package structure, and tie bars, where the die attach pad has opposite first and second sides, the semiconductor die is attached to the second side of the die attach pad, the lead has a first portion connected to a circuit of the semiconductor die by a bond wire, the package structure exposes a portion of the first side of the die attach pad and the second portion of the lead. Four tie bars extend outward from the die attach pad and the tie bars have respective ends exposed outside the package structure.