The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Aug. 22, 2023
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/007 (2006.01); H03H 3/04 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01); H03H 9/24 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02133 (2013.01); H03H 3/0073 (2013.01); H03H 3/04 (2013.01); H03H 9/02102 (2013.01); H03H 9/02448 (2013.01); H03H 9/0523 (2013.01); H03H 9/0533 (2013.01); H03H 9/0547 (2013.01); H03H 9/1021 (2013.01); H03H 9/1057 (2013.01); H03H 9/17 (2013.01); H03H 9/2426 (2013.01); H03H 9/2457 (2013.01); H03H 2003/0407 (2013.01);
Abstract
In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.