Oita, Japan

Masamitsu Matsuura

This inventor holds 18 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging. Top assignee: Texas Instruments Corporation. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masamitsu Matsuura. Retrieved from https://idiyas.com/inventor/masamitsu-matsuura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Oita, JP (2020 - 2024)
  • Beppu, JP (2023 - 2024)

Company Filing History:


Years Active: 2020-2026

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Areas of Expertise:
High Reliability Sensor
Wire Bonded Device
Conductive Terminals
Leaded Package
Electromechanical Devices
Wafer Chip Scale
Interdigitated Mold
Tapered Metal Coated
Fan-Out Device
Embedded Package
Multilayer Mold
18 patents (USPTO):Explore Patents

Title: **The Innovative Mind of Masamitsu Matsuura**

Introduction

Masamitsu Matsuura, an accomplished inventor based in Oita, Japan, has significantly contributed to the field of semiconductor technology with a remarkable tally of 13 patents. His inventive prowess is particularly evident in his latest advancements that have implications for integrated circuit packaging and electromechanical devices.

Latest Patents

Among Masamitsu Matsuura's latest patents is the groundbreaking invention titled "Hall sensor using face down structure with through substrate vias." This innovative integrated circuit package comprises a semiconductor die featuring a Hall-effect sensor circuit on its first surface, with multiple through substrate vias (TSV) that connect to a second surface. This design incorporates a leadframe with dual sets of leads, facilitating a magnetic field generation toward the sensor circuit, enhancing the functionality of the IC package.

Another notable patent pertains to "Metal ribs in electromechanical devices." In this design, a semiconductor die is coupled with a thin-film layer and an air cavity, which houses a resonator. The addition of a rib that connects to the thin-film surface amplifies the device's capabilities, showcasing Matsuura's continued commitment to advancing engineering solutions.

Career Highlights

Masamitsu Matsuura has cultivated a successful career at Texas Instruments Corporation, where he applies his innovative talents to push the boundaries of semiconductor technologies. His contributions have not only optimized existing processes but also paved the way for new applications in electronic devices.

Collaborations

Throughout his career, Masamitsu Matsuura has collaborated with fellow engineers and inventors, including notable colleagues Kengo Aoya and Anindya Poddar. These collaborations foster an environment of shared knowledge and creativity, further enhancing the inventive landscape in which he operates.

Conclusion

Masamitsu Matsuura exemplifies the spirit of innovation in the semiconductor industry. Through his patents and collaborations, he continues to leave an indelible mark, demonstrating how creativity and engineering can converge to produce groundbreaking technologies that shape the future. His work not only reflects his skill and determination but also serves as an inspiration to aspiring inventors and engineers around the world.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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