Dual down-set conductive terminals for externally mounted passive components

Abstract

In some examples, a semiconductor package comprises a first die pad having a first top surface and a first bottom surface opposing the first top surface and a second die pad in horizontal alignment with the first die pad, the second die pad having a second top surface and a second bottom surface opposing the second top surface, a gap separating the first and second die pads. The package comprises a semiconductor die electrically coupled to the first and second bottom surfaces and extending across the gap, the semiconductor die having a device side including circuitry formed therein, the device side facing away from the first and second die pads. The package comprises a first conductive terminal extending from a lateral surface of the first die pad and away from the first die pad, the first conductive terminal having multiple down-sets. The package comprises a second conductive terminal extending from a lateral surface of the second die pad and away from the second die pad, the second conductive terminal having multiple down-sets. The package comprises a third conductive terminal having fewer down-sets than the first and second conductive terminals and extending from below the first die pad and away from the first die pad. The package comprises a bond wire coupling the device side of the semiconductor die to the third conductive terminal. The package comprises a mold compound covering the semiconductor die and the bond wire, the first and second die pads exposed to an exterior of the mold compound through a top surface of the mold compound. The package comprises a passive electrical component external to the mold compound and having a first electrical contact coupled to the first die pad and having a second electrical contact coupled to the second die pad. The first, second, and third conductive terminals include distal ends that are exposed through a common side surface of the mold compound, the distal ends in horizontal alignment with each other.