The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 17, 2025

Filed:

Aug. 31, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventor:

Masamitsu Matsuura, Beppu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/482 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4951 (2013.01); H01L 23/4824 (2013.01); H01L 23/4952 (2013.01); H05K 7/1046 (2013.01);
Abstract

In a described example, an apparatus includes: a package substrate having a die pad configured for receiving a semiconductor die, and having conductive leads spaced from the die pad; a semiconductor die mounted on the die pad, the semiconductor die having bond pads on an active surface configured for making electrical connections; electrical connections coupling the bond pads of the semiconductor die to the conductive leads; mold compound covering a portion of the package substrate, the semiconductor die, and the electrical connections, with the leads extending through the mold compound and having end portions exposed from the mold compound; and the leads having a first portion with a first width and extending with the first width from the mold compound to a second portion having a second width that greater than the first width.


Find Patent Forward Citations

Matsuura, Masamitsu. (2025). Leaded semiconductor device package having leads with different widths (U.S. Patent No. 12334417). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12334417

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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