The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2024
Filed:
Jul. 30, 2021
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Mahmud Halim Chowdhury, Richardson, TX (US);
Amin Sijelmassi, Dallas, TX (US);
Murali Kittappa, Plano, TX (US);
Anindya Poddar, Sunnyvale, CA (US);
Honglin Guo, Dallas, TX (US);
Joe Adam Garcia, Royse City, TX (US);
John Paul Tellkamp, Rockwall, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01H 85/02 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01H 85/0241 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01H 2085/0283 (2013.01); H01L 23/49555 (2013.01); H01L 23/49827 (2013.01); H01L 24/73 (2013.01); H01L 2224/4801 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/48499 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/494 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/8534 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/2075 (2013.01);
Abstract
In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.