Murali Kittappa

Title: Murali Kittappa: Innovator in Semiconductor Packaging

Introduction

Murali Kittappa is a notable inventor based in Plano, TX (US). He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance the functionality and reliability of electronic devices.

Latest Patents

Murali holds a patent for "Packages with electrical fuses." This invention includes a package that comprises a semiconductor die featuring a device side and a bond pad on that side. The design incorporates a conductive terminal exposed to the exterior of the package, along with an electrical fuse. The electrical fuse consists of a conductive ball coupled to the bond pad, and a bond wire that is stitch-bonded to the conductive ball and connected to the conductive terminal. This innovative approach improves the performance and safety of electronic packages.

Career Highlights

Murali Kittappa is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work focuses on developing advanced packaging solutions that meet the evolving needs of technology.

Collaborations

Throughout his career, Murali has collaborated with talented individuals such as Mahmud Halim Chowdhury and Amin Ahmad Sijelmassi. These collaborations have contributed to the advancement of semiconductor technologies and innovations.

Conclusion

Murali Kittappa's contributions to semiconductor packaging through his patent and work at Texas Instruments Corporation highlight his role as an influential inventor in the field. His innovative designs continue to impact the electronics industry positively.