The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2025

Filed:

Jul. 29, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Vijaylaxmi Gumaste Khanolkar, Pune, IN;

Anindya Poddar, Sunnyvale, CA (US);

Hassan Omar Ali, Murphy, TX (US);

Dibyajat Mishra, Plano, TX (US);

Venkatesh Srinivasan, Plano, TX (US);

Swaminathan Sankaran, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01Q 1/2283 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/182 (2013.01); H01L 2924/2027 (2013.01);
Abstract

In a described example, an apparatus includes: a semiconductor device mounted to a device side surface of a package substrate, the package substrate having a board side surface opposite the device side surface; an antenna module mounted to the package substrate and coupled to the semiconductor device; and mold compound covering the semiconductor device and a portion of the package substrate.


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