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Shanghai, China

Acm Research (Shanghai) Inc.

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USPTO Granted Patents = 74

% Expired Patents = 1.4

Trademarks = 2

Forward Citations = 73

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74 inventors (with patents filed for the assignee):

Hui Wang (62 out of 123 patents)

Jian Wang (41 out of 123 patents)

Fuping Chen (34 out of 39 patents)

4. Xi Wang (25 out of 70 patents)

5. Zhaowei Jia (23 out of 28 patents)

6. Xiaoyan Zhang (20 out of 32 patents)

7. Liangzhi Xie (15 out of 17 patents)

8. Yinuo Jin (14 out of 19 patents)

9. Jun Wang (13 out of 176 patents)

10. Fufa Chen (12 out of 26 patents)

11. Hongchao Yang (12 out of 13 patents)

12. Shena Jia (12 out of 12 patents)

13. Yue Ma (10 out of 25 patents)

14. Jun Wu (10 out of 74 patents)

15. Xuejun Li (9 out of 15 patents)

Core Competencies:

Substrate Processing

Wafer Cleaning

Electroplating

Barrier Layer Removal

Ultrasonic Cleaning

Semiconductor Wafers

Cleaning Apparatus

Plating Method

Thermal Treatment

High Temperature Chemicals

Metallization

Particle Removal

74 patents: Sort by Forward Citations

1. 12772775 - Drying apparatus and method based on supercritical fluid (2026-10-20),

2. 12740369 - Flipping apparatus (2026-09-15),

3. 12675054 - Coating and developing device (2026-07-07),

4. 12674247 - Method for cleaning electroplating device (2026-07-07),

5. 12610777 - Substrate processing apparatus (2026-04-21),

6. 12573019 - Electroplating chamber leakage plating warning method and system (2026-03-10),

7. 12564026 - Method of removing barrier layer (2026-02-24),

8. 12544807 - Wafer cleaning apparatus (2026-02-10),

9. 12518961 - Wafer backside cleaning method (2026-01-06),

10. 12494360 - Apparatus and method for cleaning semiconductor wafers (2025-12-09),

11. 12486590 - Substrate processing method (2025-12-02),

12. 12482697 - Substrate supporting apparatus (2025-11-25),

13. 12467156 - Plating apparatus and plating method (2025-11-11),

14. 12334367 - Method and apparatus for removing particles or photoresist on substrates (2025-06-17),

15. 12186684 - Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device (2025-01-07),

Company Overview

Acm Research (Shanghai) Inc. specializes in advanced semiconductor cleaning technologies essential for the fabrication of integrated circuits. The company focuses on developing innovative solutions for substrate processing, wafer cleaning, and electroplating, addressing critical challenges in the semiconductor manufacturing process. With expertise in barrier layer removal and ultrasonic cleaning, Acm Research plays a pivotal role in enhancing the efficiency and effectiveness of cleaning apparatus used in semiconductor wafer production, primarily serving the needs of the global semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 3 2026

74 Patents

#47 in Shanghai

#440 in China

#10,140 in the World

Shanghai, China

Acm Research (Shanghai) Inc.

Forward Citations = 73

74 inventors:

Hui Wang (62 out of 123 patents)

Jian Wang (41 out of 123 patents)

Fuping Chen (34 out of 39 patents)

4. Xi Wang (25 out of 70 patents)

5. Zhaowei Jia (23 out of 28 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Acm Research (Shanghai) Inc.. Retrieved from https://idiyas.com/company/acm-research-shanghai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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