For the Inventor, By the Inventor

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Shanghai, China

Acm Research (shanghai) Inc.

USPTO Granted Patents = 65

Trademarks = 6

Forward Citations = 68

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50 inventors (with patents filed for the assignee):

Hui Wang (53 out of 105 patents)

Jian Wang (37 out of 106 patents)

Fuping Chen (32 out of 37 patents)

4. Xi Wang (25 out of 69 patents)

5. Zhaowei Jia (21 out of 26 patents)

6. Xiaoyan Zhang (17 out of 27 patents)

7. Liangzhi Xie (15 out of 17 patents)

8. Yinuo Jin (13 out of 18 patents)

9. Fufa Chen (12 out of 26 patents)

10. Jun Wang (11 out of 153 patents)

11. Yue Ma (10 out of 24 patents)

12. Hongchao Yang (10 out of 11 patents)

13. Jun Wu (9 out of 67 patents)

14. Xuejun Li (9 out of 15 patents)

15. Shena Jia (9 out of 9 patents)

Core Competencies:

Substrate Processing

Plating Apparatus

Electroplating

Semiconductor Cleaning

High Temperature Chemicals

Ultrasonic Cleaning

Metallization Techniques

Wafer Processing

Coater Technology

Barrier Layer Removal

Functional Water Production

Pulse Electrochemical Polishing

65 patents: Sort by Forward Citations

1. 12494360 - Apparatus and method for cleaning semiconductor wafers (2025-12-09),

2. 12486590 - Substrate processing method (2025-12-02),

3. 12482697 - Substrate supporting apparatus (2025-11-25),

4. 12467156 - Plating apparatus and plating method (2025-11-11),

5. 12334367 - Method and apparatus for removing particles or photoresist on substrates (2025-06-17),

6. 12186684 - Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device (2025-01-07),

7. 12111575 - Coater with automatic cleaning function and coater automatic cleaning method (2024-10-08),

8. 12100586 - Substrate cleaning method and apparatus (2024-09-24),

9. 12068149 - Apparatus and method for cleaning semiconductor wafers (2024-08-20),

10. 12062556 - Methods and apparatus for cleaning semiconductor wafers (2024-08-13),

11. 11967497 - Methods and apparatus for cleaning semiconductor wafers (2024-04-23),

12. 11955328 - Method and apparatus for cleaning semiconductor wafer (2024-04-09),

13. 11926920 - Electroplating apparatus and electroplating method (2024-03-12),

14. 11925881 - Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device (2024-03-12),

15. 11911808 - System for cleaning semiconductor wafers (2024-02-27),

ACM Research (Shanghai) Inc. is a global supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications. With an extensive portfolio of cleaning, polishing, and surface preparation technologies, ACM Research provides innovative and high-performance equipment to enhance the manufacturing processes of integrated circuits and advanced packaging. The company is headquartered in Shanghai, China and operates globally, serving customers in key semiconductor manufacturing regions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

65 Patents

#47 in Shanghai

#443 in China

#10,880 in the World

Shanghai, China

Acm Research (shanghai) Inc.

Forward Citations = 68

50 inventors:

Hui Wang (53 out of 105 patents)

Jian Wang (37 out of 106 patents)

Fuping Chen (32 out of 37 patents)

4. Xi Wang (25 out of 69 patents)

5. Zhaowei Jia (21 out of 26 patents)

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