The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Jul. 31, 2023
Acm Research (Shanghai), Inc., Shanghai, CN;
Yinuo Jin, Shanghai, CN;
Hongchao Yang, Shanghai, CN;
Jian Wang, Shanghai, CN;
Hui Wang, Shanghai, CN;
ACM Research (Shanghai) Inc., Shanghai, CN;
Abstract
The present invention discloses a plating apparatus and plating methods for plating metal layers on a substrate. In an embodiment, a plating method comprises: step 1: immersing a substrate into plating solution of a plating chamber assembly including at least a first anode and a second anode; step 2: turning on a first plating power supply applied on the first anode, setting the first plating power supply to output a power value Pand continue with a period T; step 3: when the period Tends, adjusting the first plating power supply applied on the first anode to output a power value Pand continue with a period T, at the same time, turning on a second plating power supply applied on the second anode, and setting the second plating power supply to output a power value Pand continue with a period T; and step 4: when the period Tends, adjusting the second plating power supply applied on the second anode to output a power value Pand continue with a period T; wherein step 2 to step 4 are performed periodically.