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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12544807 B1

PDFFull Text
Date of Patent:
Feb. 10, 2026

Filed:

Nov. 24, 2022

Wafer cleaning apparatus

Applicant:

Acm Research (Shanghai), Inc., Shanghai, CN;

Inventors:

Xideng He, Shanghai, CN;

Yang Han, Shanghai, CN;

Zhaoming Zhong, Shanghai, CN;

Tianyu Huang, Shanghai, CN;

Yunxiang Zhao, Shanghai, CN;

Xiaofeng Tao, Shanghai, CN;

Xinping Deng, Shanghai, CN;

Shena Jia, Shanghai, CN;

Hui Wang, Shanghai, CN;

Assignee:

ACM RESEARCH (SHANGHAI), INC., Shanghai, CN;

Attorney:

Osha Bergman Watanabe & Burton LLP

Primary Examiner:

Levon J Shahinian

Int. Cl.
CPC ...
B08B 3/02 (2006.01); B08B 5/02 (2006.01); B08B 17/02 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
B08B 5/023 (2013.01); B08B 3/02 (2013.01); B08B 3/022 (2013.01); B08B 17/02 (2013.01); H01L 21/306 (2013.01); H01L 21/67 (2013.01); H01L 21/67051 (2013.01); H01L 21/687 (2013.01); H01L 21/68792 (2013.01); Y02P 70/50 (2015.11);
Abstract

A wafer cleaning apparatus provided by the present invention comprises a rotary shaft, a chuck arranged on the top of the rotary shaft for retaining the wafer, a fixed shaft coaxially passed through the rotary shaft, and an upper end cover and a lower end cover that block the top and bottom of the fixed shaft respectively. Wherein, the fixed shaft is a hollow shaft with at least one circle of exhaust holes provided on the wall of the fixed shaft. The lower end cover is arranged with a gas inlet port, through which a protective gas is provided to the interior of the fixed shaft. The protective gas forms a positive pressure in the annular space between the fixed shaft and the rotary shaft through the at least one circle of exhaust holes. The present invention provides positive pressure protective gas to the spacing between the fixed shaft and the rotary shaft by opening exhaust holes on the wall of the fixed shaft. A gas seal is formed to prevent contaminants, such as particles and metals, generated in the bottom area of the rotary shaft from diffusing to the back side of the wafer through the annular space between the fixed shaft and the rotary shaft, thereby improving the cleanliness of the back side of the wafer after cleaning.

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