The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Feb. 13, 2024
Applicant:

Acm Research (Shanghai), Inc., Shanghai, CN;

Inventors:

Fuping Chen, Shanghai, CN;

Hui Wang, Shanghai, CN;

Xi Wang, Shanghai, CN;

Shena Jia, Shanghai, CN;

Danying Wang, Shanghai, CN;

Chaowei Jiang, Shanghai, CN;

Yingwei Dai, Shanghai, CN;

Jian Wang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 19/00 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); B08B 3/12 (2006.01); B08B 7/04 (2006.01); F04B 15/04 (2006.01); F04B 23/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); F04B 23/04 (2006.01);
U.S. Cl.
CPC ...
B01D 19/0036 (2013.01); B01D 19/00 (2013.01); B01D 19/0031 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); B08B 3/12 (2013.01); B08B 7/04 (2013.01); F04B 15/04 (2013.01); F04B 23/00 (2013.01); H01L 21/02052 (2013.01); H01L 21/02057 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01); B08B 2203/007 (2013.01); F04B 23/04 (2013.01);
Abstract

A method for cleaning substrates includes rotating a substrate; delivering deionized water on a surface of the substrate for pre wetting the surface of the substrate; delivering chemical solution with high temperature on the surface of the substrate for cleaning the surface of the substrate; changing the rotation speed of the substrate to a low rotation speed, and moving a ultra/mega sonic device. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a first cleaning cycle; turning off the ultra/mega sonic device, and delivering a high temperature chemical solution or deionized water. The method further includes turning on the ultra/mega sonic device and supplying a constant or pulse working power in a second cleaning cycle; turning off the ultra/mega sonic device, and delivering rinse chemical solution or deionized water on the surface of the substrate; and drying the substrate.


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