The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Jul. 25, 2022
Acm Research (Shanghai), Inc., Shanghai, CN;
Meng Wu, Shanghai, CN;
Chenhua Lu, Shanghai, CN;
Zhaowei Jia, Shanghai, CN;
Quan Cao, Shanghai, CN;
Jian Wang, Shanghai, CN;
Hui Wang, Shanghai, CN;
ACM RESEARCH (SHANGHAI), INC., Shanghai, CN;
Abstract
Disclosed is a substrate processing method, which comprises the following steps: S: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.