The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Nov. 24, 2022
Acm Research (Shanghai), Inc., Shanghai, CN;
Meng Wu, Shanghai, CN;
Zhaowei Jia, Shanghai, CN;
Chenhua Lu, Shanghai, CN;
Ling Qin, Shanghai, CN;
Quan Cao, Shanghai, CN;
Hongchao Yang, Shanghai, CN;
Jian Wang, Shanghai, CN;
Hui Wang, Shanghai, CN;
ACM RESEARCH (SHANGHAI), INC., Shanghai, CN;
Abstract
An electroplating chamber leakage plating warning method and system are disclosed. The method includes: positioning the electroplated wafer () at a detection location (S); setting a target detection area (S) of the wafer (); operating an image sensor () to detect the target detection area (S) of the wafer (), and determining whether there is unwanted metal deposition in the target detection area of the wafer () (S); if the determination result indicates the presence of unwanted metal deposition in the target detection area of the wafer (), indicating a leakage plating occurrence in the electroplating chamber processing the wafer (), then an alarm command is issued; if the determination result indicates that there is no unwanted metal deposition in the target detection area of the wafer (), indicating no leakage plating occurrence in the electroplating chamber processing the wafer (), then no alarm command is issued. By using a detection device to automatically perform leakage plating detection on the wafer (), it can replace manual inspection of the electroplating conditions of the wafer (), promptly detect leakage plating issues on the wafer (), and issue an alarm, facilitating the handling of the electroplating chamber by the staff.