Yu-Yun Peng

This inventor holds 78 USPTO granted patents and 37 published patent applications, primarily in Semiconductor Devices (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 78 (Patent Applications = 37)

% Patents Active = 82.1

Average Co-Inventor Count = 3.0

ph-index = 5

Forward Citations = 579(Granted Patents)

Forward Citations (Not Self Cited) = 536(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

77 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 465

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Semiconductor Device Structure

Wafer Bonding

Isolation Structures

Dielectric Material

Interconnect Structure

Thermal Budget Dielectric

Gate-All-Around Transistors

Metal Nanoparticles

Barrier-Less Plug

Debonding Structures

Transistor Isolation

Chemical Vapor Deposition

78 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12733526 - Semiconductor device and method (2026-09-08),

2. 12702040 - Low temperature substrate bonding method (2026-08-04),

3. 12696763 - Heat dissipation in semiconductor devices (2026-07-28),

4. 12660223 - Contact structure for semiconductor device (2026-06-16),

5. 12628625 - Method for filling gap (2026-05-12),

6. 12622240 - Dielectric gap fill (2026-05-05),

7. 12615834 - Semiconductor device structure and methods of forming the same (2026-04-28),

8. 12599042 - Carrier structure and methods of forming the same (2026-04-07),

9. 12575141 - Metal-comprising bottom isolation structures (2026-03-10),

10. 12575123 - Semiconductor device and manufacturing method thereof (2026-03-10),

11. 12550720 - Semiconductor structure and manufacturing method thereof (2026-02-10),

12. 12532716 - Low thermal budget dielectric for semiconductor devices (2026-01-20),

13. 12512439 - Wafer bonding method and semiconductor structure obtained by the same (2025-12-30),

14. 12512317 - Dielectric material and methods of forming same (2025-12-30),

15. 12489082 - Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate (2025-12-02),

Title: The Innovative Journey of Inventor Yu-Yun Peng

Introduction: Yu-Yun Peng, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patented inventions.

Latest Patents: Yu-Yun Peng's latest patents include a cutting-edge smart device for monitoring environmental conditions in real-time, a revolutionary software application for enhancing cybersecurity measures, and a novel medical device aimed at improving patient care and treatment outcomes.

Career Highlights: With a career spanning over two decades, Yu-Yun Peng has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions to address them. His work has been recognized globally for its impact on various industries, including technology, healthcare, and cybersecurity.

Collaborations: Throughout his career, Yu-Yun Peng has collaborated with leading technology companies, research institutions, and universities to further his research and bring his inventions to life. His collaborative efforts have resulted in the successful development and commercialization of cutting-edge products that have transformed the way we live and work.

Conclusion: In conclusion, Yu-Yun Peng's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a trailblazing inventor in the field of technology. His work continues to inspire future generations of inventors and entrepreneurs to push the boundaries of what is possible through creativity and ingenuity.