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Taichung, Taiwan

Yu-Hung Lin

USPTO Granted Patents = 68 (Patent Applications = 14)

EPO Patents = 3 (Patent Applications = 2)

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 565(Granted Patents)

Forward Citations (Not Self Cited) = 530(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsin-Chu, TW (2016 - 2023)
Taichung, TW (2013 - 2024)

Company Filing History:

60 out of 40,739

Taiwan Semiconductor Manufacturing Comp. Ltd.

Mediatek Corporation

Rhymebus Corporation

4. 2 out of 832,812

Other

patents

Years Active: 2013-2025

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Areas of Expertise:

High-Efficiency Amplifier

Semiconductor Package

Through Substrate Via

Thermal Structure

Operational Amplifier

Bio-Information Acquisition

Interconnection Structure

Metal Contact Structure

Composite Contact Plug

Barrier Structure

Contact Resistance Reduction

Silicide Formation

68 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12395136 - High-efficiency amplifier architecture with de-gain stage (2025-08-19),

2. 12374602 - Semiconductor structure having through substrate via and manufacturing method thereof (2025-07-29),

3. 12374596 - Semiconductor package and manufacturing method thereof (2025-07-29),

4. 12368280 - Semiconductor device and method (2025-07-22),

5. 12341104 - Methods of manufacturing semiconductor devices (2025-06-24),

6. 12298226 - Sensing rack and sensing rack set (2025-05-13),

7. 12272613 - Thermal structure for semiconductor device and method of forming the same (2025-04-08),

8. 12033949 - Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure (2024-07-09),

9. 11935836 - Semiconductor devices (2024-03-19),

10. 11854874 - Metal contact structure and method of forming the same in a semiconductor device (2023-12-26),

11. 11848798 - Array controlling system for controlling multiple array modules and controlling method thereof (2023-12-19),

12. 11749603 - Interconnection structure, fabricating method thereof, and semiconductor device using the same (2023-09-05),

13. 11682625 - Interconnection structure, fabricating method thereof, and semiconductor device using the same (2023-06-20),

14. 11664774 - Operational amplifier using single-stage amplifier with slew-rate enhancement and associated method (2023-05-30),

15. 11497411 - Circuit applied to bio-information acquisition system (2022-11-15),

Title: The Innovative Journey of Yu-Hung Lin

Introduction: Yu-Hung Lin, a visionary inventor hailing from Taichung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Yu-Hung Lin holds several patents in the areas of electronics and software development, with his most recent patent focusing on a cutting-edge artificial intelligence algorithm for autonomous vehicles.

Career Highlights: Lin's career highlights include working for top tech companies in Taiwan, where he spearheaded research and development projects that led to the creation of innovative products that have revolutionized the industry.

Collaborations: Throughout his career, Yu-Hung Lin has collaborated with leading researchers and engineers from around the world, fostering a culture of innovation and creativity that has resulted in numerous successful projects.

Conclusion: Yu-Hung Lin's passion for pushing the boundaries of technology and his relentless pursuit of innovation have solidified his reputation as a pioneering inventor in the global tech community.

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