Yih Wang

This inventor holds 60 USPTO granted patents and 6 published patent applications and 4 EPO patents, primarily in Thin Film Transistors (CPC class H01L). Top assignee: Intel Corporation. Active years: 2013-2026.

USPTO Granted Patents = 60 (Patent Applications = 6)

% Patents Active = 81.7

EPO Patents = 4 (Patent Applications = 10)

Average Co-Inventor Count = 3.4

ph-index = 7

Forward Citations = 167(Granted Patents)

Forward Citations (Not Self Cited) = 141(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

60 out of 56,184

Intel Corporation

patents

Years Active: 2013-2026

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Areas of Expertise:

Thin Film Transistors

Embedded Memory

Integrated Circuits

Vertical Architecture

Dynamic Random-Access Memory

Ferroelectric Capacitors

Charge Storage Memory

MIM Capacitors

3D Integrated Circuits

Magnetoresistive Memory

Low Power Operations

High Density Memory

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12660156 - Interconnect structures for integrated circuits (2026-06-16),

2. 12191395 - Dual gate control for trench shaped thin film transistors (2025-01-07),

3. 12176284 - Through plate interconnect for a vertical MIM capacitor (2024-12-24),

4. 12100705 - Deep trench via for three-dimensional integrated circuit (2024-09-24),

5. 12080643 - Integrated circuit structures having differentiated interconnect lines in a same dielectric layer (2024-09-03),

6. 11997847 - Thin film transistors with spacer controlled gate length (2024-05-28),

7. 11978804 - Recessed thin-channel thin-film transistor (2024-05-07),

8. 11862729 - Vertical multi-gate thin film transistors (2024-01-02),

9. 11862728 - Dual gate control for trench shaped thin film transistors (2024-01-02),

10. 11843054 - Vertical architecture of thin film transistors (2023-12-12),

11. 11758711 - Thin-film transistor embedded dynamic random-access memory with shallow bitline (2023-09-12),

12. 11723188 - Replacement metal COB integration process for embedded DRAM (2023-08-08),

13. 11690215 - Self-aligned bitline and capacitor via formation (2023-06-27),

14. 11653487 - 4F2 DRAM cell using vertical thin film transistor (2023-05-16),

15. 11469268 - Damascene-based approaches for embedding spin hall MTJ devices into a logic processor and the resulting structures (2022-10-11),

Title: Innovations and Contributions of Yih Wang in Semiconductor Technology

Introduction

Yih Wang, an accomplished inventor based in Portland, OR, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 59 patents, he has been at the forefront of developing innovative solutions that enhance the functionality and efficiency of various electronic devices.

Latest Patents

Among his latest inventions are groundbreaking patents that address complex challenges in thin film transistors and metal-insulator-metal (MIM) capacitors. One notable patent is the "Dual gate control for trench shaped thin film transistors," which describes an innovative structure featuring dual gate electrodes that improve the performance of semiconductor devices. The design includes a non-planar semiconductor material layer that optimizes gate control, thereby enhancing device efficiency.

Another significant patent by Wang is titled "Through plate interconnect for a vertical MIM capacitor." This invention reveals a novel interconnect structure that simplifies the assembly and enhances the performance of vertical MIM capacitors. It includes a unique integration of metal layers and dielectric materials that facilitates better electrical connectivity while minimizing space requirements on circuit boards.

Career Highlights

Yih Wang's career is closely associated with Intel Corporation, where he has played a pivotal role in developing state-of-the-art semiconductor technologies. His extensive experience and innovative mindset have not only led to numerous patents but have also contributed to advancing industry standards in electronic components.

Collaborations

Throughout his career, Yih Wang has collaborated with notable colleagues, including Tahir Ghani and Abhishek A Sharma. Together, they have worked on various projects that focus on enhancing semiconductor technologies and improving the performance metrics of electronic devices.

Conclusion

Yih Wang’s work exemplifies the spirit of innovation in the semiconductor industry. His extensive patent portfolio, coupled with his collaboration with talented colleagues at Intel Corporation, underscores the importance of continuous research and development in advancing technology. As he continues to innovate, his contributions will undeniably shape the future landscape of electronic devices and systems.