The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Jan. 25, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Yih Wang, Portland, OR (US);

Abhishek Sharma, Hillsboro, OR (US);

Sean Ma, Portland, OR (US);

Van H. Le, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 29/66 (2006.01); H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H01L 29/78642 (2013.01); H01L 29/66742 (2013.01); H10B 12/053 (2023.02); H10B 12/34 (2023.02); H10B 12/488 (2023.02);
Abstract

Vertical thin film transistors (TFTs) including a gate electrode pillar clad with a gate dielectric. The gate dielectric is further clad with a semiconductor layer. Source or drain metallization is embedded in trenches formed in an isolation dielectric adjacent to separate regions of the semiconductor layer. During TFT operation, biasing of the gate electrode can induce one or more transistor channel within the semiconductor layer, electrically coupling together the source and drain metallization. A width of the channel may be proportional to a height of the gate electrode pillar clad by the semiconductor layer, while a length of the channel may be proportional to the spacing between contacts occupied by the semiconductor layer. In some embodiments, a memory device may include cells comprising a vertical thin film select transistor and a capacitor (1TFT-1C).


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