Cupertino, CA, United States of America

Masaaki Higashitani

This inventor holds 243 USPTO granted patents and 19 published patent applications and 25 EPO patents, primarily in Memory Devices (CPC class H01L27-11582). Top assignees: Sandisk Technologies Inc., Sandisk Corporation, Sandisk 3D LLC. Active years: 2005-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masaaki Higashitani. Retrieved from https://idiyas.com/inventor/masaaki-higashitani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 243 

% Patents Active = 84.8

 

Average Co-Inventor Count = 2.8

ph-index = 25

Forward Citations = 2,637(Granted Patents)

Forward Citations (Not Self Cited) = 2,297(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Cupertinio, CA (US) (2007)
  • Cupertino, CA (2022)
  • Cupertino, CA (US) (2005 - 2024)

Company Filing History:


Years Active: 2005-2026

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Areas of Expertise:
Memory Device
Composite Metal Oxide
Three-Dimensional Memory
Ferroelectric Semiconductor
Quality Control
Tungsten Layers
Resonant Tunneling Barrier
Vertical Field Effect Transistors
Plasma-Enhanced Chemical Vapor Deposition
Interconnect-Level Bonding Pads
Dual-Level Peripheral Circuits
Non-Volatile Memories
243 patents (USPTO):Explore Patents

Title: Masaaki Higashitani: Innovator Extraordinaire in Semiconductor Technology

Introduction:

In the world of technological advancements, Masaaki Higashitani has left an indelible mark with his pioneering work in semiconductor memory devices. This article sheds light on his immense contribution, highlighting his latest patents, career highlights, collaborations, and overall impact on the field.

Latest Patents:

Masaaki Higashitani boasts an impressive portfolio of 209 patents, showcasing his expertise in semiconductor technology and memory devices. One of his notable inventions is the "Bonded three-dimensional memory devices with backside source power supply mesh and methods of making the same." This semiconductor structure revolutionizes memory die stacking by utilizing alternating insulating and conductive layers, optimizing memory fill structures, and incorporating a source power supply mesh for enhanced performance.

Another groundbreaking patent is the "Bonded assembly containing low dielectric constant bonding dielectric material." This invention allows for the bonding of different substrates using a first low-k material layer, facilitating efficient interconnection between semiconductor dies while reducing the overall dielectric constant.

Career Highlights:

Throughout his illustrious career, Masaaki Higashitani has made significant contributions to the industry. He has worked with prominent companies like SanDisk Technologies Inc., a leading flash memory storage solutions provider, and SanDisk 3D LLC, an entity dedicated to advancing 3D memory technologies. His expertise in semiconductor memory devices has played a crucial role in shaping the landscape of data storage solutions.

Collaborations:

Masaaki Higashitani has also collaborated with esteemed professionals in the field, including Peter Rabkin and Mohan Dunga. These collaborations have fostered an environment of innovation, leading to the development of novel technologies and solutions.

Conclusion:

Masaaki Higashitani's impressive repertoire of patents and his influential contributions to the semiconductor memory industry have propelled technological advancements in data storage and processing. His groundbreaking inventions, such as bonded three-dimensional memory devices and low dielectric constant bonding, have paved the way for enhanced performance and efficiency.

As an AI assistant at idiyas.com, we are proud to highlight the achievements of visionaries like Masaaki Higashitani, whose dedication and innovation continue to shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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