IDiyas

For the Inventor, By the Inventor

Shanghai, China

Weiping Li

USPTO Granted Patents = 17 

Average Co-Inventor Count = 1.1

ph-index = 1


Company Filing History:

goldMedal15 out of 15 
 
Yibu Semiconductor Co., Ltd.
 patents
silverMedal2 out of 2,349 
 
Lear Corporation
 patents

Years Active: 2018-2025

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17 patents (USPTO):
1. 12431465 - Chip package and method of forming chip packages (2025-09-30),
2. 12406964 - Chip package and method of forming chip packages (2025-09-02),
3. 12368124 - Method for forming semiconductor package and semiconductor package (2025-07-22),
4. 12362327 - Method of forming packages of stacked chips (2025-07-15),
5. 12293986 - Method for forming chip packages and a chip package (2025-05-06),
6. 12224267 - Chip interconnecting method, interconnect device and method for forming chip packages (2025-02-11),
7. 12218090 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2025-02-04),
8. 12159850 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2024-12-03),
9. 12154884 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2024-11-26),
10. 12125776 - Method for forming semiconductor package and semiconductor package (2024-10-22),
11. 12087737 - Method of forming chip package having stacked chips (2024-09-10),
12. 12087734 - Method for forming chip packages and a chip package having a chipset comprising a first chip and a second chip (2024-09-10),
13. 12046525 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2024-07-23),
14. 11973061 - Chip package including stacked chips and chip couplers (2024-04-30),
15. 11955396 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2024-04-09),

Title: Weiping Li: Innovator in Chip Packaging Technology

Introduction

Weiping Li is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor packaging, holding a total of 17 patents. His innovative approaches have advanced the technology used in chip packaging, making it more efficient and effective.

Latest Patents

Among his latest patents is a method of forming chip packages. This method involves assembling at least one chip layer over a carrier substrate, which includes chip couplers and chips. Each chip has a front side facing the carrier substrate, with chip contacts formed on the front side. The process includes encapsulating the chip layer to create a molded package structure, thinning it to expose the first bumps, and forming a metal layer on the exposed side. Another notable patent describes a method for forming a stack of chip layers on a carrier, encapsulating them in a molding compound, and forming a redistribution layer on the front side of the first chip layer.

Career Highlights

Weiping Li has worked with several notable companies throughout his career. He has been associated with Yibu Semiconductor Co., Ltd. and Lear Corporation, where he has applied his expertise in semiconductor technology. His work has been instrumental in developing advanced packaging solutions that enhance the performance of electronic devices.

Collaborations

Weiping Li has collaborated with several professionals in his field, including Yue Zuo and XiaoZhong Wu. These collaborations have contributed to the successful development of innovative technologies in chip packaging.

Conclusion

Weiping Li's contributions to the field of chip packaging technology are noteworthy. His patents and career achievements reflect his dedication to innovation and excellence in semiconductor technology. His work continues to influence the industry and pave the way for future advancements.

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