The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Dec. 27, 2021
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Weiping Li, Shanghai, CN;
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Abstract
A semiconductor packaging method, a semiconductor assembly and an electronic device are disclosed herein. The semiconductor packaging method comprises providing at least one semiconductor device, a carrier board, and a clamping board. The at least one semiconductor device has a passive surface with first alignment solder parts formed thereon, and the carrier board has a plurality of corresponding second alignment solder parts formed thereon. The method further comprises forming alignment solder joints by aligning and soldering the first alignment solder parts to respective ones of the second alignment solder parts; and injecting a molding compound through one or more openings in one or both of the carrier board and the clamping board to form a molded package body encapsulating the at least one semiconductor device between the carrier board and the clamping board attached to the active surface of the at least one semiconductor device.