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Shanghai, China

Yibu Semiconductor Co., Ltd.

USPTO Granted Patents = 16

Forward Citations = 4

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1 inventor (with patents filed for the assignee):

Weiping Li (16 out of 18 patents)

16 patents: Sort by Forward Citations

1. 12500203 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2025-12-16),

2. 12431465 - Chip package and method of forming chip packages (2025-09-30),

3. 12406964 - Chip package and method of forming chip packages (2025-09-02),

4. 12368124 - Method for forming semiconductor package and semiconductor package (2025-07-22),

5. 12362327 - Method of forming packages of stacked chips (2025-07-15),

6. 12293986 - Method for forming chip packages and a chip package (2025-05-06),

7. 12224267 - Chip interconnecting method, interconnect device and method for forming chip packages (2025-02-11),

8. 12218090 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2025-02-04),

9. 12159850 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2024-12-03),

10. 12154884 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2024-11-26),

11. 12125776 - Method for forming semiconductor package and semiconductor package (2024-10-22),

12. 12087737 - Method of forming chip package having stacked chips (2024-09-10),

13. 12087734 - Method for forming chip packages and a chip package having a chipset comprising a first chip and a second chip (2024-09-10),

14. 12046525 - Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly (2024-07-23),

15. 11973061 - Chip package including stacked chips and chip couplers (2024-04-30),

Company Overview

Yibu Semiconductor Co., Ltd. is a prominent player in the semiconductor industry, specializing in the design and manufacture of advanced semiconductor components. The company focuses on developing innovative solutions for various applications, including consumer electronics, telecommunications, and automotive systems. With its headquarters in Shanghai, Yibu Semiconductor leverages cutting-edge technology and research to enhance performance and efficiency in electronic devices, contributing to the evolution of modern technology.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

16 Patents

#168 in Shanghai

#1,817 in China

#37,868 in the World

Shanghai, China

Yibu Semiconductor Co., Ltd.

Forward Citations = 4

1 inventor:

Weiping Li (16 out of 18 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Yibu Semiconductor Co., Ltd.. Retrieved from https://idiyas.com/company/yibu-semiconductor-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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