The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Jan. 31, 2022
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Weiping Li, Shanghai, CN;
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Abstract
A semiconductor packaging method, a semiconductor assembly and an electronic device are disclosed herein. The semiconductor packaging method comprises forming a first-stage assembly, including: align and fix at least one first-stage device to a target position on a carrier plate by utilizing the self-alignment capability of first-stage alignment solder joints; and while using a clamping board to support an exposed side of the at least one first-stage device, performing injection molding through an opening in the carrier board or the clamping board. The packaging method further comprises align and fix a second-stage device to a target position on the first-stage assembly by utilizing the self-alignment capability of second-level alignment solder joints between the first-stage assembly and the second-stage device. The packaging method improves the operation speed and accuracy of the picking and placing of the first-stage device and the second-stage device, resulting in improved process efficiency and reduced process cost.