The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Feb. 21, 2022
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Weiping Li, Shanghai, CN;
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Abstract
A semiconductor packaging method, a semiconductor assembly and an electronic device are disclosed herein. The semiconductor packaging method comprises forming a first-level assembly, including: align and fix at least one first-level device to a target position on a carrier plate by utilizing the self-alignment capability of first-level alignment solder joints; encapsulating the at least one first-level device to form a molded package body; and exposing the first-level interconnect terminals from the molded package body. The packaging method further comprises align and fix a second-level device to a target position on the first-level assembly by utilizing the self-alignment capability of second-stage alignment solder joints between the first-level assembly and the second-level device. The packaging method improves the operation speed and accuracy of the picking and placing of the first-level device and the second-level device, resulting in improved process efficiency and reduced process cost.