The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2024
Filed:
Nov. 26, 2021
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Weiping Li, Shanghai, CN;
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Abstract
A method of forming a package comprises forming a stack of chip layers. Each chip layer has a front side facing away from the carrier substrate. A first chip layer includes a plurality of first chips having first chip contacts on the front side of the first chip layer and chip couplers having through vias. A second chip layer includes a plurality of second chip having second chip contacts on the front side of the second chip layer and coupled to respective ones of at least a first subset of the through vias. The method further comprises forming a redistribution layer on the front side of the first chip layer and dividing the stack of chip layers and the redistribution layer to form a plurality of chip packages. A chip package thus formed include a stack of chips and one or more chip connectors on a singulated redistribution layer.