The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Nov. 26, 2021
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Weiping Li, Shanghai, CN;
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Abstract
A method of forming a package comprises forming a stack of chip layers on a carrier. The stack of chip layers including at least a first chip layer over the carrier and a second chip layer over the first chip layer. The first chip layer includes a plurality of first chips facing the carrier and a plurality of chip couplers. The second chip layer includes a plurality of second chips facing the first chip layer. The method further comprises encapsulating the stack of chip layers in a molding compound, removing the carrier to expose the front side of the first chip layer, forming a redistribution layer on the front side of the first chip layer and bumps on the redistribution layer, and dividing the stack of chips and the redistribution layer to form a plurality of the packages. A chip package thus formed include a stack of chips and one or more chip connectors on a singulated redistribution layer.