The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Dec. 04, 2021
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Weiping Li, Shanghai, CN;
Yibu Semiconductor Co., Ltd., Shanghai, CN;
Abstract
The present disclosure provides a chip interconnecting method, an interconnect device and a method for forming a chip interconnection package. The method comprises arranging at least one chipset on a carrier, each chipset including at least a first chip and a second chip. A contact surface (or diameter) of each of the first bumps is smaller than that of any of the second bumps. The method further comprises attaching an interconnect device to the first chip and the second chip, the interconnect device including first pads for bonding to corresponding bumps on the first chip and second pads for bonding to corresponding bumps on the second chip. Attaching the interconnect device includes aligning the plurality of first pads with the corresponding bumps on the first chip whereby the plurality of second pads are self-aligned for bonding to the plurality of second bumps.