logo

For the Inventor, By the Inventor

Taipei, Taiwan

Sheng-Yuan Lee

This inventor holds 72 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Inductor Technology (CPC class H01L). Top assignees: Via Technologies, Inc., Via Labs, Inc., Asustek Computer Inc.. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Yuan Lee. Retrieved from https://idiyas.com/inventor/sheng-yuan-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 72 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.1

ph-index = 10

Forward Citations = 325(Granted Patents)

Forward Citations (Not Self Cited) = 310(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Shindian, TW (2007 - 2008)
  • Hsin-Tien, TW (2006 - 2010)
  • Taipei County, TW (2009 - 2011)
  • Taipei, TW (2006 - 2012)
  • Taipei Hsien, TW (2007 - 2013)
  • New Taipei, TW (2012 - 2023)

Company Filing History:

goldMedal64 out of 1,975 
 
Via Technologies, Inc.
 patents
silverMedal7 out of 44 
 
Via Labs, Inc.
 patents
bronzeMedal1 out of 1,676 
 
Asustek Computer Inc.
 patents

Years Active: 2006-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Inductor Structure
Multilayer Inductor
Integrated Circuit
Electronic Assembly
Circuit Board
Paddle Card
Differential Signal
Active Optical Cable
Leadframe Package
Spiral Inductor
Electrical Connector
Power Control Device
72 patents (USPTO):Explore Patents
1. 12598694 - Circuit board and electronic assembly (2026-04-07),
2. 12354947 - Multilayer-type on-chip inductor structure (2025-07-08),
3. 12284815 - Multilayer-type on-chip inductor structure (2025-04-21),
4. 12107043 - Multilayer-type on-chip inductor structure (2024-10-01),
5. 11735502 - Integrated circuit chip, package substrate and electronic assembly (2023-08-22),
6. 11605590 - Multilayer-type on-chip inductor structure (2023-03-14),
7. 11367773 - On-chip inductor structure (2022-06-21),
8. 10468830 - Paddle card and plug-cable assembly (2019-11-05),
9. 10218127 - Paddle card and plug-cable assembly (2019-02-26),
10. 10103217 - Semiconductor device having inductor (2018-10-16),
11. 9991327 - Semiconductor device having inductor (2018-06-05),
12. 9703343 - Transmittal system and connection device (2017-07-11),
13. 9583555 - Semiconductor device having inductor (2017-02-28),
14. 9444165 - Pin arrangement and electronic assembly (2016-09-13),
15. 9443843 - Integrated circuit device (2016-09-13),

Title: The Innovative Journey of Inventor Sheng-Yuan Lee

Introduction: Sheng-Yuan Lee, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Sheng-Yuan Lee's latest patents showcase his commitment to innovation and include advancements in renewable energy technologies, smart devices, and sustainable materials.

Career Highlights: Throughout his illustrious career, Sheng-Yuan Lee has been recognized for his pioneering work in the development of eco-friendly solutions, cutting-edge electronics, and efficient manufacturing processes. His patents have revolutionized various industries and have set new standards for innovation.

Collaborations: Sheng-Yuan Lee has collaborated with leading research institutions, universities, and technology companies to further his inventions and bring them to market. His partnerships have been instrumental in the successful implementation of his groundbreaking ideas.

Conclusion: In conclusion, Sheng-Yuan Lee's passion for innovation, coupled with his dedication to creating a sustainable future, has solidified his position as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…