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Via Labs, Inc.

USPTO Granted Patents = 38

EPO Patents = 2

Trademarks = 3

Forward Citations = 21

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48 inventors (with patents filed for the assignee):

Sheng-Yuan Lee (6 out of 71 patents)

Hsiao-Chyi Lin (5 out of 10 patents)

Tze-Shiang Wang (5 out of 9 patents)

4. Chin-Sung Hsu (5 out of 9 patents)

5. Terrance Shiyang Shih (4 out of 6 patents)

6. Wei-Yu Wang (4 out of 13 patents)

7. Yu-Chung Wei (4 out of 7 patents)

8. Cheng-Chung Lin (3 out of 4 patents)

9. Yi-Shing Lin (3 out of 5 patents)

10. Nai-Chuan Hung (3 out of 3 patents)

11. Sheng-Hsien Yen (3 out of 7 patents)

12. Hui-Neng Chang (3 out of 3 patents)

13. Chien-Sheng Chen (2 out of 4 patents)

14. Shao-Yu Chen (2 out of 2 patents)

15. Li-Feng Pan (2 out of 3 patents)

38 patents: Sort by Forward Citations

1. 12354947 - Multilayer-type on-chip inductor structure (2025-07-08),

2. 12328113 - PD controller IC and control method for power switch (2025-06-10),

3. 12284815 - Multilayer-type on-chip inductor structure (2025-04-21),

4. 12197366 - USB integrated circuit, operation method of USB integrated circuit and USB device (2025-01-14),

5. 12107043 - Multilayer-type on-chip inductor structure (2024-10-01),

6. 12055963 - PD controller IC (2024-08-06),

7. 12021367 - Protection circuit and hub chip (2024-06-25),

8. 11914491 - USB integrated circuit, testing platform and operating method for USB integrated circuit (2024-02-27),

9. 11874927 - Electronic apparatus and secure firmware update method thereof (2024-01-16),

10. 11775041 - Multi-port power supply device and operation method thereof (2023-10-03),

11. 11770015 - Power management device and method (2023-09-26),

12. 11768786 - Connection interface conversion chip, connection interface conversion device and operation method (2023-09-26),

13. 11755087 - Multi-port power supply device and operation method thereof (2023-09-12),

14. 11735502 - Integrated circuit chip, package substrate and electronic assembly (2023-08-22),

15. 11605590 - Multilayer-type on-chip inductor structure (2023-03-14),

VIA Labs, Inc. is a leading provider of innovative USB solutions. With expertise in USB hubs, controllers, and adapters, VIA Labs offers cutting-edge products that enhance connectivity for consumers and businesses. Through continuous research and development, VIA Labs prides itself on delivering high-quality, reliable USB solutions that meet the evolving needs of the market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

38 Patents

#159 in Taipei

#487 in Taiwan

#17,287 in the World

Via Labs, Inc.

Forward Citations = 21

48 inventors:

Sheng-Yuan Lee (6 out of 71 patents)

Hsiao-Chyi Lin (5 out of 10 patents)

Tze-Shiang Wang (5 out of 9 patents)

4. Chin-Sung Hsu (5 out of 9 patents)

5. Terrance Shiyang Shih (4 out of 6 patents)

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