New Taipei, Taiwan

Via Labs, Inc.


USPTO Granted Patents = 44


Trademarks = 1

Forward Citations = 23

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50 inventors (with patents filed for the assignee):

goldMedal Sheng-Yuan Lee (7 out of 72 patents)

silverMedal Hsiao-Chyi Lin (6 out of 11 patents)

bronzeMedal Tze-Shiang Wang (6 out of 10 patents)

4.  Chin-Sung Hsu (5 out of 9 patents)

5.  Wei-Yu Wang (5 out of 14 patents)

6.  Yu-Chung Wei (5 out of 8 patents)

7.  Terrance Shiyang Shih (4 out of 6 patents)

8.  Nai-Chuan Hung (4 out of 4 patents)

9.  Sheng-Hsien Yen (4 out of 8 patents)

10.  Hui-Neng Chang (4 out of 4 patents)

11.  Cheng-Chung Lin (3 out of 4 patents)

12.  Yi-Shing Lin (3 out of 5 patents)

13.  Yu-Lung Lin (3 out of 8 patents)

14.  Chien-Sheng Chen (2 out of 4 patents)

15.  Shao-Yu Chen (2 out of 2 patents)


Core Competencies:
Power Management
USB Integrated Circuit
Interface Conversion
Multilayer Inductor
Electronic Assembly
Testing System
PD Controller
Firmware Update
Connection Interface
Audio Transmission
Chip Design
Voltage Comparator

44 patents:

Via Labs, Inc. is a technology company based in New Taipei, Taiwan, specializing in the development of advanced semiconductor solutions. The company focuses on high-performance USB and connectivity technologies, catering to a wide range of applications including consumer electronics, computing, and automotive sectors. Via Labs is committed to innovation in data transfer and power delivery, enhancing user experiences through reliable and efficient products. Their expertise in integrated circuit design positions them as a key player in the global electronics market.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Oct 6 2026

44 Patents

#76 in New Taipei

#443 in Taiwan

#15,738 in the World

New Taipei, TW
New Taipei, Taiwan
Forward Citations = 23

50 inventors:

Please report any incorrect information to [email protected]
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