The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Apr. 29, 2024
Via Labs, Inc., New Taipei City, TW;
Sheng-Yuan Lee, New Taipei City, TW;
VIA LABS, INC., New Taipei City, TW;
Abstract
A circuit board is suitable for mounting an electronic package. The circuit board includes a power layer and a circuit board surface which includes a package region corresponding to the electronic package. The package region is rectangular and includes four sides. The power layer includes a first power plane, a second power plane, a third power plane, and the forth power plane. An orthographic projection of the second power plane on the circuit board surface extends from outside into the package region and extending through at least three of the sides. An area of the orthogonal projection of the second power plane on the circuit board surface in the package region is greater than areas of the orthogonal projections of the other power planes on the circuit board surface in the package region. In addition, an electronic assembly including the circuit board and the electronic package is also provided.