The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2018

Filed:

Feb. 23, 2017
Applicant:

Via Technologies, Inc., New Taipei, TW;

Inventor:

Sheng-Yuan Lee, New Taipei, TW;

Assignee:

VIA TECHNOLOGIES, INC., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 49/02 (2006.01); H01L 23/528 (2006.01); H01L 29/06 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5227 (2013.01); H01L 29/0619 (2013.01);
Abstract

A semiconductor device includes first and second winding portions disposed in a first level of an insulating layer and surrounding a center region thereof. Each of the winding portions includes conductive lines arranged from the inside to the outside. First and second extending conductive lines are disposed in the first level of the insulating layer. A third extending conductive line is disposed in a second level of the insulating layer. The first extending conductive line is coupled between the innermost conductive line of the second winding and the third extending conductive line. The second extending conductive line is coupled between the innermost conductive line of the first winding portion and the third extending conductive line. The first extending conductive line and the third extending conductive line coupled thereto are arranged in a helix or a spiral spatial configuration.


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