The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Nov. 24, 2014
Applicant:

Via Technologies, Inc., New Taipei, TW;

Inventor:

Sheng-Yuan Lee, New Taipei, TW;

Assignee:

VIA Technologies, Inc., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/77 (2011.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H01R 13/6473 (2011.01); H01R 13/6471 (2011.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01R 12/771 (2013.01); H01R 13/6473 (2013.01); H05K 1/025 (2013.01); H05K 1/118 (2013.01); H05K 1/147 (2013.01); H01R 13/6471 (2013.01); H05K 1/117 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A pin arrangement adapted to a FPC connector is provided. The pin arrangement includes a pin lane. The pin lane includes a pair of ground pins, a pair of differential pins and at least one not-connected (NC) pin. The differential pins are located between the pair of ground pins. The at least one NC pin is located between the pair of differential pins or between one of the pair of ground pins and one of the pair of differential pins adjacent thereto. By adding the at least one NC pin between the pair of differential pins and/or between the differential pin and the ground pin adjacent thereto, a distance between each of the pair of the differential pins and/or between the differential pin and the ground pin is increased, and thus a differential characteristic impedance of the pair of differential pins is raised to reduce the impact of impedance mismatch.


Find Patent Forward Citations

Loading…