The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2017

Filed:

Jul. 30, 2015
Applicant:

Via Technologies, Inc., New Taipei, TW;

Inventor:

Sheng-Yuan Lee, New Taipei, TW;

Assignee:

VIA TECHNOLOGIES, INC., New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); H01L 23/5227 (2013.01); H01L 27/0248 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device including a first insulating layer and a second insulating layer sequentially disposed on a substrate having a center region. The semiconductor device includes a first winding portion and a second winding portion disposed in the second insulating layer and surrounding the center region A second conductive line and a third conductive line are arranged from the inside to the outside. In addition, each of the first, second and third conductive lines has a first end and a second end. The semiconductor device also includes a coupling portion disposed in the first and second insulating layers between the first and second winding portions, and having a first pair of connection layers cross-connecting the second ends of the first and second conductive lines, and a second pair of connection layers cross-connecting the first ends of the second and third conductive lines.


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