Seokhyun Lee

This inventor holds 78 USPTO granted patents and 29 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 78 (Patent Applications = 29)

% Patents Active = 98.7

EPO Patents = 2 (Patent Applications = 4)

Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 92(Granted Patents)

Forward Citations (Not Self Cited) = 52(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

69 out of 132,108

Samsung Electronics Co., Ltd.

patents

9 out of 5,871

Samsung Electronics Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Semiconductor Package

Manufacturing Method

Under Bump Metallization

Redistribution Substrate

Display Module Package

Fabrication Techniques

Embedded Passive Device

3D Packaging

Thermal Management

Seed Patterns

Seed Layers

78 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12740447 - Semiconductor packages having conductive patterns including wiring patterns and under-bump patterns, and methods of fabricating the same (2026-09-15),

2. 12721217 - Semiconductor package and method of manufacturing the same (2026-08-25),

3. 12721190 - Semiconductor package (2026-08-25),

4. 12685213 - Semiconductor package and method for manufacturing the semiconductor package (2026-07-14),

5. 12660666 - Semiconductor package and method of manufacturing the semiconductor package (2026-06-16),

6. 12642145 - Semiconductor package (2026-05-26),

7. 12604779 - Semiconductor package and method of manufacturing the semiconductor package (2026-04-14),

8. 12593737 - Semiconductor package (2026-03-31),

9. 12581978 - Semiconductor package including under bump metallization pad (2026-03-17),

10. 12519086 - Semiconductor package with redistribution substrate (2026-01-06),

11. 12519079 - Method of manufacturing semiconductor package (2026-01-06),

12. 12494412 - Semiconductor package (2025-12-09),

13. 12453204 - Semiconductor package and method of manufacturing the same (2025-10-21),

14. 12394753 - Semiconductor package (2025-08-19),

15. 12394700 - Semiconductor package (2025-08-19),

Title: Seokhyun Lee: Pioneering Inventor from Hwaseong-si, South Korea

Introduction: Seokhyun Lee is a distinguished inventor hailing from Hwaseong-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Seokhyun Lee holds several patents in the areas of artificial intelligence, robotics, and renewable energy, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Seokhyun Lee has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the realm of technology.

Collaborations: Throughout his career, Seokhyun Lee has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and excellence in all his projects.

Conclusion: Seokhyun Lee's passion for innovation and his relentless drive to create a better future through technology make him a true pioneer in the world of inventions.