The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2026
Filed:
Sep. 27, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes first semiconductor chips electrically connected to each other through a through-via electrically connecting a first front surface pad and a first rear surface pad. A second semiconductor chip has a second lower surface including a second front surface pad, a second upper surface, a second side surface extending from the second upper surface, and a recess surface extending from the second lower surface to the second side surface. First adhesive films are on a first lower surface of first semiconductor chips and include first extension portions extending further outwardly than a first side surface of the first semiconductor chips. A second adhesive film is on the second lower surface and includes a second extension portion extending further outwardly than the second side surface. In a horizontal direction, a length of the second extension portion is less than a length of each of the first extension portions.