Masaya Seki

This inventor holds 53 USPTO granted patents and 13 published patent applications and 11 EPO patents, primarily in Plating Technology. Top assignees: Ebara Corporation, Kabushiki Kaisha Toshiba, Nihon Micro Coating Co., Ltd.. Active years: 2004-2026.

USPTO Granted Patents = 53 (Patent Applications = 13)

% Patents Active = 96.2

EPO Patents = 11 (Patent Applications = 10)

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 110(Granted Patents)

Forward Citations (Not Self Cited) = 91(Dec 10, 2025)

Company Filing History:

Kabushiki Kaisha Toshiba

patents

1 out of 51

Nihon Micro Coating Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 2004-2026

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Areas of Expertise:

Plating Apparatus

Substrate Holder

Polishing Method

Pre-Wet Module

Cleaning Process

Wetting Method

Deaerated Liquid

Film Thickness Measurement

Polishing Tool

Substrate Processing

Abnormality Detection

Electrical Contact

53 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12612710 - Substrate holder, substrate plating device equipped therewith, and electrical contact (2026-04-28),

2. 12359339 - Plating apparatus and substrate holder operation method (2025-07-15),

3. 12347697 - Prewet module and prewet method (2025-07-01),

4. 12270120 - Plating apparatus and plating method (2025-04-08),

5. 12247311 - Plating apparatus and plating process method (2025-03-11),

6. 12180606 - Plating apparatus (2024-12-31),

7. 12152311 - Wetting method for substrate and plating apparatus (2024-11-26),

8. 12134833 - Plating apparatus and cleaning method of contact member of plating apparatus (2024-11-05),

9. 12076760 - Pre-wet module, deaerated liquid circulation system, and pre-wet method (2024-09-03),

10. 12054840 - Plating apparatus, pre-wet process method, and cleaning process method (2024-08-06),

11. 11906299 - Plating apparatus and film thickness measuring method for substrate (2024-02-20),

12. 11846035 - Plating apparatus and plating method (2023-12-19),

13. 11833551 - Pre-wet module, deaerated liquid circulation system, and pre-wet method (2023-12-05),

14. 11535949 - Substrate holder and plating apparatus (2022-12-27),

15. 11511386 - Polishing apparatus and polishing method (2022-11-29),

Title: Masaya Seki: Pioneering Inventor from Tokyo

Introduction: Masaya Seki is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Masaya Seki holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancements.

Career Highlights: With a career spanning over two decades, Masaya Seki has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs in various industries.

Collaborations: Throughout his career, Masaya Seki has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing to drive progress in the tech sector.

Conclusion: Masaya Seki's relentless passion for innovation and his pioneering spirit have solidified his reputation as a visionary inventor, shaping the landscape of technology not only in Tokyo but on a global scale.