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For the Inventor, By the Inventor

Tokyo, Japan

Masaya Seki

USPTO Granted Patents = 52 

 

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 109(Granted Patents)

Forward Citations (Not Self Cited) = 91(Dec 10, 2025)


Company Filing History:

goldMedal52 out of 2,510 
 
Ebara Corporation
 patents
silverMedal3 out of 52,735 
 
Kabushiki Kaisha Toshiba
 patents
bronzeMedal1 out of 51 
 
Nihon Micro Coating Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2004-2025

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Areas of Expertise:
Plating Apparatus
Substrate Holder
Polishing Apparatus
Prewet Module
Deaerated Liquid Circulation
Film Thickness Measurement
Substrate Processing
Polishing Method
Semiconductor Device Manufacturing
Wetting Method
Cleaning Process
Abnormality Detection
52 patents (USPTO):Explore Patents
1. 12359339 - Plating apparatus and substrate holder operation method (2025-07-15),
2. 12347697 - Prewet module and prewet method (2025-07-01),
3. 12270120 - Plating apparatus and plating method (2025-04-08),
4. 12247311 - Plating apparatus and plating process method (2025-03-11),
5. 12180606 - Plating apparatus (2024-12-31),
6. 12152311 - Wetting method for substrate and plating apparatus (2024-11-26),
7. 12134833 - Plating apparatus and cleaning method of contact member of plating apparatus (2024-11-05),
8. 12076760 - Pre-wet module, deaerated liquid circulation system, and pre-wet method (2024-09-03),
9. 12054840 - Plating apparatus, pre-wet process method, and cleaning process method (2024-08-06),
10. 11906299 - Plating apparatus and film thickness measuring method for substrate (2024-02-20),
11. 11846035 - Plating apparatus and plating method (2023-12-19),
12. 11833551 - Pre-wet module, deaerated liquid circulation system, and pre-wet method (2023-12-05),
13. 11535949 - Substrate holder and plating apparatus (2022-12-27),
14. 11511386 - Polishing apparatus and polishing method (2022-11-29),
15. 11230789 - Method of removing liquid from seal of a substrate holder (2022-01-25),

Title: Masaya Seki: Pioneering Inventor from Tokyo

Introduction: Masaya Seki is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Masaya Seki holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancements.

Career Highlights: With a career spanning over two decades, Masaya Seki has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs in various industries.

Collaborations: Throughout his career, Masaya Seki has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing to drive progress in the tech sector.

Conclusion: Masaya Seki's relentless passion for innovation and his pioneering spirit have solidified his reputation as a visionary inventor, shaping the landscape of technology not only in Tokyo but on a global scale.

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