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For the Inventor, By the Inventor

Tokyo, Japan

Ebara Corporation

Calculating rank
USPTO Granted Patents = 2,581

% Expired Patents = 13.4



Trademarks = 17

Forward Citations = 26,447

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1,640 inventors (with patents filed for the assignee):

goldMedal Tetsuji Togawa (141 out of 146 patents)

silverMedal Osamu Nabeya (100 out of 100 patents)

bronzeMedal Masahiro Hatakeyama (98 out of 99 patents)

4.  Norio Kimura (94 out of 142 patents)

5.  Hiroyuki Shinozaki (92 out of 96 patents)

6.  Nobuharu Noji (91 out of 93 patents)

7.  Tohru Satake (87 out of 90 patents)

8.  Makoto Fukushima (84 out of 84 patents)

9.  Hozumi Yasuda (84 out of 84 patents)

10.  Takeshi Murakami (75 out of 89 patents)

11.  Toshifumi Kimba (72 out of 74 patents)

12.  Mitsuru Miyazaki (61 out of 68 patents)

13.  Jumpei Fujikata (57 out of 57 patents)

14.  Tsutomu Karimata (57 out of 58 patents)

15.  Shoji Yoshikawa (56 out of 84 patents)


Core Competencies:
Substrate Processing
Plating Apparatus
Polishing Method
Cleaning Device
Electrical Contact
Chemical Mechanical Polishing
Film Thickness Detection
Data Management
Anode Holder
Transfer Device
Pump Apparatus
Magnetic Bearing

2,581 patents:

1. 12777879 - Substrate processing apparatus (2026-10-27),
2. 12776468 - Insulating structure, electrostatic lens, and charged particle beam device (2026-10-27),
3. 12766663 - Polishing apparatus and polishing method (2026-10-20),
4. 12766662 - Polishing apparatus with microwave detection sensor (2026-10-20),
5. 12766573 - Abrasion detection device, abrasion detection method, substrate cleaning device, and substrate cleaning method (2026-10-20),
6. 12765302 - Substrate cleaning apparatus and substrate cleaning method (2026-10-13),
7. 12760727 - Reciprocating pump (2026-10-13),
8. 12759108 - Polishing method, and polishing apparatus (2026-10-13),
9. 12745586 - Substrate processing method and substrate processing apparatus (2026-09-22),
10. 12741354 - Polishing pad, polishing apparatus, and polishing method (2026-09-22),
11. 12736431 - Method of detecting leakage of substrate holder (2026-09-15),
12. 12735799 - Plating apparatus and plating method (2026-09-15),
13. 12728497 - Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus (2026-09-08),
14. 12728495 - Polishing apparatus and polishing method (2026-09-08),
15. 12722244 - Polishing apparatus (2026-09-01),
Company Overview
Ebara Corporation, headquartered in Tokyo, Japan, specializes in advanced substrate processing technologies essential for semiconductor manufacturing. The company focuses on developing innovative solutions in areas such as plating apparatus, polishing methods, and cleaning devices. Ebara's expertise extends to chemical mechanical polishing and film thickness detection, providing critical support for the precision and efficiency required in semiconductor fabrication. With a commitment to research and development, Ebara plays a vital role in enhancing data management and operational capabilities within the industry.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

Ebara Corporation USPTO Patent Assignee Logo
2,581 Patents

#49 in Tokyo

#95 in Japan

#373 in the World

Tokyo, JP
Tokyo, Japan

Ebara Corporation

Forward Citations = 26,447

1,640 inventors:

goldMedal Tetsuji Togawa (141 out of 146 patents)

silverMedal Osamu Nabeya (100 out of 100 patents)

bronzeMedal Masahiro Hatakeyama (98 out of 99 patents)

4.  Norio Kimura (94 out of 142 patents)

5.  Hiroyuki Shinozaki (92 out of 96 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ebara Corporation. Retrieved from https://idiyas.com/company/ebara

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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