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Ebara Corporation

USPTO Granted Patents = 2,508

CIPO Patents = 10

EPO Patents = 216

Trademarks = 38

Forward Citations = 25,745

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1,782 inventors (with patents filed for the assignee):

Tetsuji Togawa (141 out of 146 patents)

Osamu Nabeya (100 out of 100 patents)

Masahiro Hatakeyama (96 out of 97 patents)

4. Norio Kimura (94 out of 142 patents)

5. Nobuharu Noji (91 out of 93 patents)

6. Hiroyuki Shinozaki (89 out of 93 patents)

7. Tohru Satake (87 out of 90 patents)

8. Makoto Fukushima (84 out of 84 patents)

9. Hozumi Yasuda (83 out of 83 patents)

10. Takeshi Murakami (74 out of 88 patents)

11. Toshifumi Kimba (71 out of 73 patents)

12. Mitsuru Miyazaki (58 out of 65 patents)

13. Jumpei Fujikata (57 out of 57 patents)

14. Shoji Yoshikawa (56 out of 84 patents)

15. Tsutomu Karimata (55 out of 56 patents)

Core Competencies:

Substrate Cleaning

Chemical Mechanical Polishing

Additive Manufacturing

Magnetic Bearing

Plating Apparatus

Data Management

Polishing Head

Substrate Processing

Cleaning System

Purge Apparatus

Transfer Apparatus

Subfab Area Installation

2,508 patents: Sort by Forward Citations

1. 12485516 - Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus (2025-12-02),

2. 12480221 - Pre-wet process method (2025-11-25),

3. D1102398 - Seal for chemical mechanical polishing device (2025-11-18),

4. 12472601 - Method of checking leakage of fluid and polishing apparatus (2025-11-18),

5. 12463062 - Substrate processing apparatus, computer-readable storage medium storing a program, and substrate processing method (2025-11-04),

6. 12459039 - AM apparatus for manufacturing a fabricated object and method for testing an irradiation position of a beam in the AM apparatus (2025-11-04),

7. 12454978 - Magnetic bearing apparatus with axial pole segments (2025-10-28),

8. 12447449 - Chemical supply apparatus, cleaning system, and chemical supply method (2025-10-21),

9. 12442102 - Apparatus for plating and method of plating (2025-10-14),

10. 12430092 - Display system with a rotary machine and drive machine (2025-09-30),

11. 12429058 - Purge apparatus and purge method (2025-09-30),

12. 12420378 - Substrate processing apparatus and method for controlling dressing of polishing member (2025-09-23),

13. 12416092 - Plating apparatus (2025-09-16),

14. 12411908 - Data management method for semiconductor manufacturing apparatus and control device provided with ring buffer (2025-09-09),

15. 12410535 - Anode holder, and plating apparatus (2025-09-09),

EBARA CORPORATION is a Japan-based company engaged in the manufacturing and sale of industrial machinery, environmental control equipment, pumps, turbines, and semiconductors. The company operates through various segments including Fluid Machinery & Systems, Precision Machinery, Environmental Engineering, and others. It offers a wide range of products and services in the fields of water supply, wastewater treatment, air conditioning, energy, and more. EBARA CORPORATION strives to contribute to the sustainable development of society through its advanced technologies and innovative solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

2,508 Patents

#47 in Tokyo

#97 in Japan

#374 in the World

Ebara Corporation

Forward Citations = 25,745

1,782 inventors:

Tetsuji Togawa (141 out of 146 patents)

Osamu Nabeya (100 out of 100 patents)

Masahiro Hatakeyama (96 out of 97 patents)

4. Norio Kimura (94 out of 142 patents)

5. Nobuharu Noji (91 out of 93 patents)

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