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For the Inventor, By the Inventor

Tokyo, Japan

Jumpei Fujikata

USPTO Granted Patents = 57 

 

Average Co-Inventor Count = 2.5

ph-index = 8

Forward Citations = 568(Granted Patents)

Forward Citations (Not Self Cited) = 541(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal57 out of 2,510 
 
Ebara Corporation
 patents

Years Active: 2011-2025

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Areas of Expertise:
Semiconductor Manufacturing
Plating Apparatus
Substrate Holder
Powder Supply Apparatus
Leak Check Method
Bump Height Measurement
Electrolytic Plating
Electrical Contact
Plating Method
Substrate Processing
Wave Absorbing Member
Substrate Cleaning
57 patents (USPTO):Explore Patents
1. 12191178 - Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus (2025-01-07),
2. 12116687 - Powder supply apparatus and plating system (2024-10-15),
3. 11891715 - Paddle, processing apparatus having the paddle, and method of producing the paddle (2024-02-06),
4. 11717796 - Paddle, plating apparatus equipped with the paddle, and plating method (2023-08-08),
5. 11686647 - Leak check method, leak check apparatus, plating method, and plating apparatus (2023-06-27),
6. 11604150 - Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium (2023-03-14),
7. 11535949 - Substrate holder and plating apparatus (2022-12-27),
8. 11447885 - Plating method and plating apparatus (2022-09-20),
9. 11385125 - Leak check method, leak check apparatus, plating method, and plating apparatus (2022-07-12),
10. 11371155 - Method and apparatus for processing a substrate (2022-06-28),
11. 11359304 - Powder supply apparatus and plating system (2022-06-14),
12. 11315812 - Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus (2022-04-26),
13. 11230789 - Method of removing liquid from seal of a substrate holder (2022-01-25),
14. 11047063 - Plating apparatus and plating method (2021-06-29),
15. 10954603 - Substrate holder, plating apparatus, plating method, and electric contact (2021-03-23),

Title: The Innovative Mind of Jumpei Fujikata

Introduction: Jumpei Fujikata is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jumpei Fujikata's latest patents include a cutting-edge virtual reality device that has revolutionized the gaming industry, as well as a sustainable energy solution that aims to tackle environmental challenges.

Career Highlights: With a career spanning over two decades, Jumpei Fujikata has consistently pushed the boundaries of technological advancement. His work has been recognized globally, earning him prestigious awards and accolades.

Collaborations: Throughout his career, Jumpei Fujikata has collaborated with leading tech companies, research institutions, and universities to bring his innovative ideas to life. His collaborative spirit has led to the development of groundbreaking technologies that have impacted various industries.

Conclusion: Jumpei Fujikata's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and shape the landscape of innovation.

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